Preparation method of light-emitting device
The invention discloses a preparation method of a light-emitting device. The preparation method comprises the following steps: providing at least one light-emitting chip; the at least one light-emitting chip is adsorbed and transferred to a target carrier through a porous structure layer with a plur...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a preparation method of a light-emitting device. The preparation method comprises the following steps: providing at least one light-emitting chip; the at least one light-emitting chip is adsorbed and transferred to a target carrier through a porous structure layer with a plurality of through holes; filling the plurality of through holes with mixed glue, wherein the mixed glue comprises a color conversion material; and curing the mixed glue, so that the light-emitting surface of the light-emitting chip and the porous structure layer are bonded and fixed, and the light-emitting device integrating the porous structure layer, the light-emitting chip and the target carrier is formed. According to the preparation method of the light-emitting device, the light-emitting chip is adsorbed on the target carrier through the through holes in the porous structure layer, then the color conversion structure is manufactured by filling the mixed glue through the through holes, and the color conversion s |
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