Resin composition

The invention provides a resin composition. The resin composition includes a resin and an inorganic filler. The resin comprises bismaleimide resin and polyphenyl ether resin. The inorganic filler comprises a first inorganic filler and a second inorganic filler. The first inorganic filler has an aver...

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Hauptverfasser:	LIU JIALIN, HUANG WEIRU, LIAO DECHAO, ZHANG HONGYI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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creator	LIU JIALIN HUANG WEIRU LIAO DECHAO ZHANG HONGYI
description	The invention provides a resin composition. The resin composition includes a resin and an inorganic filler. The resin comprises bismaleimide resin and polyphenyl ether resin. The inorganic filler comprises a first inorganic filler and a second inorganic filler. The first inorganic filler has an average particle size of 0.3 [mu] m to 0.6 [mu] m. The average particle size of the second inorganic filler is 20 microns to 50 microns. 本发明提供一种树脂组合物。树脂组合物包括树脂以及无机填充物。树脂包括双马来酰亚胺树脂与聚苯醚树脂。无机填充物包括第一无机填充物与第二无机填充物。第一无机填充物的平均粒径为0.3微米至0.6微米。第二无机填充物的平均粒径为20微米至50微米。
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The inorganic filler comprises a first inorganic filler and a second inorganic filler. The first inorganic filler has an average particle size of 0.3 [mu] m to 0.6 [mu] m. The average particle size of the second inorganic filler is 20 microns to 50 microns. 本发明提供一种树脂组合物。树脂组合物包括树脂以及无机填充物。树脂包括双马来酰亚胺树脂与聚苯醚树脂。无机填充物包括第一无机填充物与第二无机填充物。第一无机填充物的平均粒径为0.3微米至0.6微米。第二无机填充物的平均粒径为20微米至50微米。</description><language>chi ; eng</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240507&DB=EPODOC&CC=CN&NR=117986838A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240507&DB=EPODOC&CC=CN&NR=117986838A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU JIALIN</creatorcontrib><creatorcontrib>HUANG WEIRU</creatorcontrib><creatorcontrib>LIAO DECHAO</creatorcontrib><creatorcontrib>ZHANG HONGYI</creatorcontrib><title>Resin composition</title><description>The invention provides a resin composition. The resin composition includes a resin and an inorganic filler. The resin comprises bismaleimide resin and polyphenyl ether resin. The inorganic filler comprises a first inorganic filler and a second inorganic filler. The first inorganic filler has an average particle size of 0.3 [mu] m to 0.6 [mu] m. The average particle size of the second inorganic filler is 20 microns to 50 microns. 本发明提供一种树脂组合物。树脂组合物包括树脂以及无机填充物。树脂包括双马来酰亚胺树脂与聚苯醚树脂。无机填充物包括第一无机填充物与第二无机填充物。第一无机填充物的平均粒径为0.3微米至0.6微米。第二无机填充物的平均粒径为20微米至50微米。</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAMSi3OzFNIzs8tyC_OLMnMz-NhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaG5pYWZhbGFo7GxKgBAOacH_M</recordid><startdate>20240507</startdate><enddate>20240507</enddate><creator>LIU JIALIN</creator><creator>HUANG WEIRU</creator><creator>LIAO DECHAO</creator><creator>ZHANG HONGYI</creator><scope>EVB</scope></search><sort><creationdate>20240507</creationdate><title>Resin composition</title><author>LIU JIALIN ; HUANG WEIRU ; LIAO DECHAO ; ZHANG HONGYI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117986838A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>LIU JIALIN</creatorcontrib><creatorcontrib>HUANG WEIRU</creatorcontrib><creatorcontrib>LIAO DECHAO</creatorcontrib><creatorcontrib>ZHANG HONGYI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIU JIALIN</au><au>HUANG WEIRU</au><au>LIAO DECHAO</au><au>ZHANG HONGYI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Resin composition</title><date>2024-05-07</date><risdate>2024</risdate><abstract>The invention provides a resin composition. The resin composition includes a resin and an inorganic filler. The resin comprises bismaleimide resin and polyphenyl ether resin. The inorganic filler comprises a first inorganic filler and a second inorganic filler. The first inorganic filler has an average particle size of 0.3 [mu] m to 0.6 [mu] m. The average particle size of the second inorganic filler is 20 microns to 50 microns. 本发明提供一种树脂组合物。树脂组合物包括树脂以及无机填充物。树脂包括双马来酰亚胺树脂与聚苯醚树脂。无机填充物包括第一无机填充物与第二无机填充物。第一无机填充物的平均粒径为0.3微米至0.6微米。第二无机填充物的平均粒径为20微米至50微米。</abstract><oa>free_for_read</oa></addata></record>
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subjects	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
title	Resin composition
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