Resin composition

The invention provides a resin composition. The resin composition includes a resin and an inorganic filler. The resin comprises bismaleimide resin and polyphenyl ether resin. The inorganic filler comprises a first inorganic filler and a second inorganic filler. The first inorganic filler has an aver...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LIU JIALIN, HUANG WEIRU, LIAO DECHAO, ZHANG HONGYI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The invention provides a resin composition. The resin composition includes a resin and an inorganic filler. The resin comprises bismaleimide resin and polyphenyl ether resin. The inorganic filler comprises a first inorganic filler and a second inorganic filler. The first inorganic filler has an average particle size of 0.3 [mu] m to 0.6 [mu] m. The average particle size of the second inorganic filler is 20 microns to 50 microns. 本发明提供一种树脂组合物。树脂组合物包括树脂以及无机填充物。树脂包括双马来酰亚胺树脂与聚苯醚树脂。无机填充物包括第一无机填充物与第二无机填充物。第一无机填充物的平均粒径为0.3微米至0.6微米。第二无机填充物的平均粒径为20微米至50微米。