Method and apparatus for repairing defects of sample using focused particle beam

The present invention relates to a method of repairing at least one defect (320) of a sample (205, 300, 1500) using a focused particle beam (227), comprising the steps of: (a) creating (1850) at least one first locally conductive sacrificial layer (400, 500) on the sample (205, 300, 1500) wherein th...

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Bibliographische Detailangaben
Hauptverfasser: ORTH NICOLE, LINO DAVID, FETTIG RAINER
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present invention relates to a method of repairing at least one defect (320) of a sample (205, 300, 1500) using a focused particle beam (227), comprising the steps of: (a) creating (1850) at least one first locally conductive sacrificial layer (400, 500) on the sample (205, 300, 1500) wherein the first locally conductive sacrificial layer (400, 500) has a first portion (410, 510) and at least one second portion (420, 530, 540, 550, 560) wherein the first portion (410, 510) is adjacent to the at least one defect (320) and the second portion (420, 530, 540, 550, 560) is adjacent to the at least one defect (320); and wherein the first portion (410, 510) and the at least one second portion (420, 530, 540, 550, 560) are electrically conductively connected to each other (570, 580); and (b) generating (1860) at least one first reference mark (425, 435, 445, 455, 535, 545, 555, 565) on the at least one second portion (420, 530, 540, 550, 560) of the first locally conductive sacrificial layer (400, 500) for correc