Method for preventing large bonding pad from whitening after design and tin spraying of crimping hole

The invention provides a method for preventing a large bonding pad from becoming white after design and tin spraying of a crimping hole. The method comprises the step of optimizing tin immersion parameters and air duct parameters in the tin spraying stage. The method can effectively solve the proble...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUA WEIZHEN, YOU CHENGDONG, GUO QIMIN, WEI GUOJUN, WU QIAOLEI, ZHANG XIAOHU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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