Method for preventing large bonding pad from whitening after design and tin spraying of crimping hole

The invention provides a method for preventing a large bonding pad from becoming white after design and tin spraying of a crimping hole. The method comprises the step of optimizing tin immersion parameters and air duct parameters in the tin spraying stage. The method can effectively solve the problem that the tin surface of the circuit board with the crimping hole and the large bonding pad becomes white, the product quality is improved, and the production cost is reduced. 本发明提供一种防止压接孔设计喷锡后大焊盘发白的方法，所述方法包括优化喷锡阶段的浸锡参数以及风道参数。所述方法可以有效解决压接孔和大焊盘的电路板锡面发白问题，提高产品质量，降低生产成本。