LED laser sorting and die bonding method

The invention relates to the technical field of LED manufacturing, in particular to an LED laser sorting and die bonding method which comprises the following steps that LED wafers are divided into bins through an automatic optical inspection system, LEDs in different bins are coded into different groups, and the performance of the LEDs in the same group is relatively consistent; wafer expansion is carried out on the LED wafer after bin division; dividing the LED wafer after wafer expansion into a plurality of wafer areas, numbering each wafer area, and determining group information of a single LED in each wafer area; preparing a plurality of UV films, and numbering the UV films to enable the numbers of the UV films to be matched with the numbers of the wafer areas; carrying out transfer printing on the LED in the wafer area to a UV film; carrying out LED die bonding according to the group information of the LEDs on the UV film; according to the invention, the steps of precise bin division, wafer expansion pro