High-frequency device packaging assembly and high-frequency device

The invention discloses a high-frequency device packaging assembly and a high-frequency device, the high-frequency device packaging assembly comprises a high-frequency connector terminal, a transmission line and a high-frequency chip, a signal transmission electrode is arranged on a first side surfa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN WEI, WANG JIAN, LI MING, ZHU NINGHUA, CAO KEQI, SUN YUZHOU, CHEN JIA, LIU YU, WEN HUASHUN, ZHANG XINYAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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