High-frequency device packaging assembly and high-frequency device

The invention discloses a high-frequency device packaging assembly and a high-frequency device, the high-frequency device packaging assembly comprises a high-frequency connector terminal, a transmission line and a high-frequency chip, a signal transmission electrode is arranged on a first side surfa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LIN WEI, WANG JIAN, LI MING, ZHU NINGHUA, CAO KEQI, SUN YUZHOU, CHEN JIA, LIU YU, WEN HUASHUN, ZHANG XINYAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention discloses a high-frequency device packaging assembly and a high-frequency device, the high-frequency device packaging assembly comprises a high-frequency connector terminal, a transmission line and a high-frequency chip, a signal transmission electrode is arranged on a first side surface of the transmission line, and a high-frequency electrode is arranged on a first side surface of the high-frequency chip; one part of the first side face of the transmission line faces the high-frequency connector terminal and enables the signal transmission electrode to be electrically connected with the high-frequency connector terminal in a flip-chip bonding mode, and the other part of the first side face of the transmission line faces the first side face of the high-frequency chip and enables the signal transmission electrode to be electrically connected with the high-frequency electrode in a flip-chip bonding mode. According to the high-frequency device packaging assembly, flip-chip bonding is used for repla