Chemical mechanical polishing solution and application thereof

The invention provides a chemical mechanical polishing solution and application thereof. The chemical mechanical polishing solution comprises grinding particles, a corrosion inhibitor, organic carboxylic acid, an oxidizing agent and water. After the technical scheme is adopted, compared with the prior art, the chemical mechanical polishing solution disclosed by the invention can effectively solve the problems of over-high metal corrosion, sinking and erosion in the polishing process of tungsten. 本发明提供了一种化学机械抛光液及其用途，其中所述化学机械抛光液包括研磨颗粒，腐蚀抑制剂，有机羧酸，氧化剂和水。采用了本发明的技术方案后，与现有技术相比，本发明的化学机械抛光液能够有效改善在钨的抛光过程中存在的过高的金属腐蚀、凹陷与侵蚀问题。