POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE

Provided is a power semiconductor device which dissipates heat from a semiconductor element and has high heat dissipation performance. The power semiconductor device includes a semiconductor device, a heat sink, grease, an adhesive, and a terminal block, and the semiconductor device includes a semiconductor element, a sealing material for sealing the semiconductor element, and a power terminal electrically connected to the semiconductor element. A first region, which is a selective region on the lower surface of the semiconductor device, is bonded to the heat sink by means of an adhesive, the semiconductor device is in contact with the heat sink via grease in a second region, which is a region other than the selective region on the lower surface of the semiconductor device, and the terminal block has an electrode on the upper surface. A power terminal of the semiconductor device is fixed to the terminal block and electrically connected to an electrode of the terminal block. 提供一种从半导体元件进行散热的散热性高的电力用半导体装置。电力用半导体