Pattern forming substrate manufacturing method and liquid discharging apparatus

The invention provides a pattern forming substrate manufacturing method and a liquid discharging apparatus capable of ensuring certain position accuracy of a pattern. A pattern forming substrate manufacturing method according to the present invention includes performing a plurality of relative movem...

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1. Verfasser: KYOSO TADASHI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a pattern forming substrate manufacturing method and a liquid discharging apparatus capable of ensuring certain position accuracy of a pattern. A pattern forming substrate manufacturing method according to the present invention includes performing a plurality of relative movements between a substrate and a liquid discharge head, and discharging a liquid from the liquid discharge head to the substrate during each relative movement to form a pattern on the substrate: performing a first relative movement; forming a first pattern element on the substrate by discharging the liquid from the liquid discharge head; performing a second relative movement to discharge the liquid from the liquid discharge head and form a second pattern element at a position in contact with the first pattern element, thereby forming a pattern including the first pattern element and the second pattern element; and applying a relative movement speed slower than the relative movement speed in the second relative moveme