Electronic device and test method of electronic device

The invention provides an electronic device. The electronic device comprises a substrate, a first contact pad, a second contact pad, an electronic element and a third contact pad, the first contact pad and the second contact pad are arranged on the substrate. The electronic component is located above the substrate and electrically connected with the first contact pad and the second contact pad. The third contact pad is electrically connected with the first contact pad. The invention also provides a test method of the electronic device. 本揭示提供一种电子装置，包括基板、第一接触垫、第二接触垫、电子元件以及第三接触垫。第一接触垫以及第二接触垫设置于基板上。电子元件位于基板上方且与第一接触垫以及第二接触垫电性连接。第三接触垫电性连接第一接触垫。本揭示也提供一种电子装置的测试方法。