Automatic cover pressing device for IGBT module packaging

The invention relates to the technical field of semiconductor devices, in particular to an IGBT module packaging automatic cover pressing device which comprises a base, an adjusting assembly, an equidistant transmission assembly and a lifting assembly, a supporting frame is installed at the top of the base, and an electric push rod is installed at the bottom of the supporting frame. According to the IGBT module clamping device, the distance between the clamping blocks on the left side and the right side is smaller, meanwhile, the distance between the clamping blocks on the front side and the rear side is correspondingly decreased under the cooperation of the equal-distance transmission assembly, then each set of clamping blocks can clamp an IGBT module more stably, and therefore it can be ensured that each set of clamping blocks can clamp the small-size IGBT module more tightly; on the contrary, the distance between the clamping blocks can be adjusted according to the actual size requirement, it is ensured th