SUBSTRATE PROCESSING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING METHOD, AND RECORDING MEDIUM
The invention provides a technology capable of shortening cooling time of a heat insulation portion, and relates to a substrate processing apparatus, a method of manufacturing a semiconductor device, a substrate processing method, and a recording medium. The substrate processing apparatus includes:...
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| creator | OKAMIYA HIROKI KOMAE YASUAKI HONDA KOICHI |
| description | The invention provides a technology capable of shortening cooling time of a heat insulation portion, and relates to a substrate processing apparatus, a method of manufacturing a semiconductor device, a substrate processing method, and a recording medium. The substrate processing apparatus includes: a processing container for processing a substrate; a cover for closing the opening in the lower part of the processing container; an elevator that moves the cover up and down; a heat insulation part provided between the cover and the substrate and having a cylindrical part formed in a cylindrical shape with a closed upper end; and a cooling gas supply unit for supplying a purge gas from a discharge port in the cylinder unit to purge the inside of the heat-insulating unit in a state in which the cover closes the opening, and for supplying a cooling gas from the discharge port to cool the heat-insulating unit in a state in which the cover does not close the opening.
本发明提供能够缩短隔热部的冷却时间的技术，涉及基板处理装置、半导体装置的制造方法、基板处理方法以及记录 |
| format | Patent |
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本发明提供能够缩短隔热部的冷却时间的技术，涉及基板处理装置、半导体装置的制造方法、基板处理方法以及记录</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240430&DB=EPODOC&CC=CN&NR=117954350A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240430&DB=EPODOC&CC=CN&NR=117954350A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OKAMIYA HIROKI</creatorcontrib><creatorcontrib>KOMAE YASUAKI</creatorcontrib><creatorcontrib>HONDA KOICHI</creatorcontrib><title>SUBSTRATE PROCESSING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING METHOD, AND RECORDING MEDIUM</title><description>The invention provides a technology capable of shortening cooling time of a heat insulation portion, and relates to a substrate processing apparatus, a method of manufacturing a semiconductor device, a substrate processing method, and a recording medium. The substrate processing apparatus includes: a processing container for processing a substrate; a cover for closing the opening in the lower part of the processing container; an elevator that moves the cover up and down; a heat insulation part provided between the cover and the substrate and having a cylindrical part formed in a cylindrical shape with a closed upper end; and a cooling gas supply unit for supplying a purge gas from a discharge port in the cylinder unit to purge the inside of the heat-insulating unit in a state in which the cover closes the opening, and for supplying a cooling gas from the discharge port to cool the heat-insulating unit in a state in which the cover does not close the opening.
本发明提供能够缩短隔热部的冷却时间的技术，涉及基板处理装置、半导体装置的制造方法、基板处理方法以及记录</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjL0KwjAURrs4iPoO1z2CpRZxvN7c2gxJSn5cS5E4iRbqA_joVuro4PTB-Q5nnr18PPrgMDA0zhJ7r8wJsGlwZNEL0BxqK6GyDjSaWCGF6D6OZ63IGhkpjJ_ksyIW8DM3NQSgkeCYrJMTlSrqZTa7drchrb67yNYVB6o3qX-0aei7S7qnZ0smz_eHcleUWyz-cd7UTDyz</recordid><startdate>20240430</startdate><enddate>20240430</enddate><creator>OKAMIYA HIROKI</creator><creator>KOMAE YASUAKI</creator><creator>HONDA KOICHI</creator><scope>EVB</scope></search><sort><creationdate>20240430</creationdate><title>SUBSTRATE PROCESSING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING METHOD, AND RECORDING MEDIUM</title><author>OKAMIYA HIROKI ; KOMAE YASUAKI ; HONDA KOICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117954350A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>OKAMIYA HIROKI</creatorcontrib><creatorcontrib>KOMAE YASUAKI</creatorcontrib><creatorcontrib>HONDA KOICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OKAMIYA HIROKI</au><au>KOMAE YASUAKI</au><au>HONDA KOICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PROCESSING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING METHOD, AND RECORDING MEDIUM</title><date>2024-04-30</date><risdate>2024</risdate><abstract>The invention provides a technology capable of shortening cooling time of a heat insulation portion, and relates to a substrate processing apparatus, a method of manufacturing a semiconductor device, a substrate processing method, and a recording medium. The substrate processing apparatus includes: a processing container for processing a substrate; a cover for closing the opening in the lower part of the processing container; an elevator that moves the cover up and down; a heat insulation part provided between the cover and the substrate and having a cylindrical part formed in a cylindrical shape with a closed upper end; and a cooling gas supply unit for supplying a purge gas from a discharge port in the cylinder unit to purge the inside of the heat-insulating unit in a state in which the cover closes the opening, and for supplying a cooling gas from the discharge port to cool the heat-insulating unit in a state in which the cover does not close the opening.
本发明提供能够缩短隔热部的冷却时间的技术，涉及基板处理装置、半导体装置的制造方法、基板处理方法以及记录</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SUBSTRATE PROCESSING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING METHOD, AND RECORDING MEDIUM |
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