SUBSTRATE PROCESSING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING METHOD, AND RECORDING MEDIUM

The invention provides a technology capable of shortening cooling time of a heat insulation portion, and relates to a substrate processing apparatus, a method of manufacturing a semiconductor device, a substrate processing method, and a recording medium. The substrate processing apparatus includes: a processing container for processing a substrate; a cover for closing the opening in the lower part of the processing container; an elevator that moves the cover up and down; a heat insulation part provided between the cover and the substrate and having a cylindrical part formed in a cylindrical shape with a closed upper end; and a cooling gas supply unit for supplying a purge gas from a discharge port in the cylinder unit to purge the inside of the heat-insulating unit in a state in which the cover closes the opening, and for supplying a cooling gas from the discharge port to cool the heat-insulating unit in a state in which the cover does not close the opening. 本发明提供能够缩短隔热部的冷却时间的技术，涉及基板处理装置、半导体装置的制造方法、基板处理方法以及记录