Resin composition

The invention provides a resin composition. The resin composition comprises novel low dielectric resin, a cross-linking agent, polyphenyl ether resin, a halogen-free flame retardant and a siloxane coupling agent. The novel low-dielectric resin has a styryl ratio of 10%-40%, a divinylbenzene ratio of...

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Hauptverfasser:	HUANG WEIRU, LIU JIALIN, LIAO DECHAO, ZHANG HONGYI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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creator	HUANG WEIRU LIU JIALIN LIAO DECHAO ZHANG HONGYI
description	The invention provides a resin composition. The resin composition comprises novel low dielectric resin, a cross-linking agent, polyphenyl ether resin, a halogen-free flame retardant and a siloxane coupling agent. The novel low-dielectric resin has a styryl ratio of 10%-40%, a divinylbenzene ratio of 10%-40% and an ethylene ratio of 10%-20%, can effectively reduce the dielectric loss of the resin composition, and achieves a low-dielectric electrical specification. 本发明提供一种树脂组成物，包括新型低介电树脂、交联剂、聚苯醚树脂、无卤耐燃剂以及硅氧烷偶合剂。新型低介电树脂具有10％至40％的苯乙烯基比例、10％至40％的二乙烯苯比例以及10％至20％的乙烯比例，可有效地降低树脂组成物的介电耗损，达到低介电的电性规格。
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The resin composition comprises novel low dielectric resin, a cross-linking agent, polyphenyl ether resin, a halogen-free flame retardant and a siloxane coupling agent. The novel low-dielectric resin has a styryl ratio of 10%-40%, a divinylbenzene ratio of 10%-40% and an ethylene ratio of 10%-20%, can effectively reduce the dielectric loss of the resin composition, and achieves a low-dielectric electrical specification. 本发明提供一种树脂组成物，包括新型低介电树脂、交联剂、聚苯醚树脂、无卤耐燃剂以及硅氧烷偶合剂。新型低介电树脂具有10％至40％的苯乙烯基比例、10％至40％的二乙烯苯比例以及10％至20％的乙烯比例，可有效地降低树脂组成物的介电耗损，达到低介电的电性规格。</description><language>chi ; eng</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240430&DB=EPODOC&CC=CN&NR=117946511A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240430&DB=EPODOC&CC=CN&NR=117946511A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUANG WEIRU</creatorcontrib><creatorcontrib>LIU JIALIN</creatorcontrib><creatorcontrib>LIAO DECHAO</creatorcontrib><creatorcontrib>ZHANG HONGYI</creatorcontrib><title>Resin composition</title><description>The invention provides a resin composition. 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subjects	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
title	Resin composition
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