Resin composition

The invention provides a resin composition. The resin composition comprises novel low dielectric resin, a cross-linking agent, polyphenyl ether resin, a halogen-free flame retardant and a siloxane coupling agent. The novel low-dielectric resin has a styryl ratio of 10%-40%, a divinylbenzene ratio of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HUANG WEIRU, LIU JIALIN, LIAO DECHAO, ZHANG HONGYI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a resin composition. The resin composition comprises novel low dielectric resin, a cross-linking agent, polyphenyl ether resin, a halogen-free flame retardant and a siloxane coupling agent. The novel low-dielectric resin has a styryl ratio of 10%-40%, a divinylbenzene ratio of 10%-40% and an ethylene ratio of 10%-20%, can effectively reduce the dielectric loss of the resin composition, and achieves a low-dielectric electrical specification. 本发明提供一种树脂组成物,包括新型低介电树脂、交联剂、聚苯醚树脂、无卤耐燃剂以及硅氧烷偶合剂。新型低介电树脂具有10%至40%的苯乙烯基比例、10%至40%的二乙烯苯比例以及10%至20%的乙烯比例,可有效地降低树脂组成物的介电耗损,达到低介电的电性规格。