Resin composition

The invention provides a resin composition which comprises novel low dielectric resin, SBS (styrene-butadiene-styrene) resin, a cross-linking agent, polyphenyl ether resin, a halogen-free flame retardant, spherical silicon dioxide and a siloxane coupling agent, and the novel low dielectric resin is maleic imide resin. According to the formula, the resin composition can maintain low dielectric, improve resin fluidity and glass transition temperature, and strengthen overall processability. 本发明提供一种树脂组成物，包括新型低介电树脂、SBS树脂、交联剂、聚苯醚树脂、无卤耐燃剂、球型二氧化硅以及硅氧烷偶合剂，其中新型低介电树脂为顺丁烯亚酰胺树脂。藉此配方，树脂组成物可在维持低介电的同时，提升树脂流动性与玻璃转移温度，强化整体加工性。