Photosensitive resin composition containing polyimide precursor

The invention discloses a compound, the structure of the compound is shown in the following formula (2): # imgabs0 #, R1 and R2 are the same or different, and R1 and R2 are respectively and independently selected from one of C1-6 alkyl, phenyl, substituted phenyl and adamantyl group. The invention also provides application of the compound in polyimide resin, a polyimide film and/or a pattern curing film. The invention further provides a resin composition which is high in photosensitive resolution, remarkably low in dissolution rate in an exposure area, high in dissolution rate in a non-exposure area and high in chemical resistance. 本发明公开一种化合物，所述化合物结构如下式(2)所示：#imgabs0#其中，R1、R2相同或不同，R1、R2分别独立地选自C1～6烷基、苯基、取代苯基和金刚烷基团中的一种。本发明还提供该化合物在聚酰亚胺树脂、聚酰亚胺膜和/或图案固化膜中的应用。本发明进一步提供一种树脂组合物，其感光分辨率高，曝光区溶解速率显著低，非曝光区溶解速率高，耐化学药品性强。