Encapsulating film

The application relates to an encapsulation film, a method of manufacturing the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. The encapsulation film includes an encapsulation layer which is a cured product of an encapsulation composition containing an encapsulation resin and a moisture absorbent, the encapsulation layer being a single layer and including a first region, a second region, and a third region in which concentrations of the moisture absorbent differ according to a thickness direction, therefore, a structure capable of blocking moisture or oxygen from flowing into the organic electronic device from the outside can be formed, and long-term reliability of the organic electronic device can be ensured. 本申请涉及封装膜、其制造方法、包括其的有机电子装置和使用其制造有机电子装置的方法。封装膜包括封装层，所述封装层为封装组合物的固化产物，封装组合物包含封装树脂和吸湿剂，封装层为单层并且包括其中吸湿剂的浓度根据厚度方向不同的第一区域、第二区域和第三区域，因此可以形成能够阻挡水分或氧从外部流入有机电子装置中的结构，并且可以确保有机电子装置的长期可靠性。