Support-equipped substrate and semiconductor device

The purpose of the present invention is to provide a substrate with a support and a semiconductor device in which stress inside a wiring layer is relaxed and cracks starting from a stress-concentrated site are unlikely to occur. Therefore, according to the present invention, in a substrate with a support, which is provided with a support and a wiring substrate provided above the support, an insulating film inside the wiring substrate is configured from a first organic insulating resin, and electrodes that can be bonded to a semiconductor element or the like are provided on a first surface and a second surface of the wiring substrate. The insulating film of the upper or lower surface layer of the wiring substrate is composed of a second organic insulating resin, and the CTE of the second organic insulating resin is smaller than the CTE of the first organic insulating resin. 本发明的目的在于提供缓和布线层内部的应力、难以产生以应力集中的部位为起点的裂纹的带支持体的基板以及半导体装置。因此，在本发明中，在具备支持体和设置在所述支持体的上方的布线基板的带支持体的基板中，所述布线基板的内部的绝缘膜由第1有机绝缘树脂构成，在所述布线基板的第1面和第2面设