Substrate

Provided is a substrate having an electrode and a plating layer formed on the electrode, the plating layer including a Ni/Cu/Sn plating layer in this order from the electrode side, an intermetallic compound layer of Cu and Sn being present at the interface between the Cu layer and the Sn layer, and...

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Bibliographische Detailangaben
Hauptverfasser:	MIZUSHIRO MASAAKI, INOUE MITSUNORI, YAMAMOTO KAZUYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Provided is a substrate having an electrode and a plating layer formed on the electrode, the plating layer including a Ni/Cu/Sn plating layer in this order from the electrode side, an intermetallic compound layer of Cu and Sn being present at the interface between the Cu layer and the Sn layer, and the intermetallic compound layer including pores. 本发明提供一种基板，其具有电极和形成于该电极上的镀覆层，上述镀覆层从电极侧起依次包含Ni/Cu/Sn镀覆层，在上述Cu层与Sn层的界面中存在Cu和Sn的金属间化合物层，上述金属间化合物层中包含孔洞。