RESIN COMPOSITION, MOLDED ARTICLE AND FILM

This resin composition contains a polyimide and an acrylic resin, and the polyimide contains, as a tetracarboxylic acid dianhydride component, an alicyclic tetracarboxylic acid dianhydride such as 1, 2, 3, 4-cyclobutane tetracarboxylic acid dianhydride, and contains, as a diamine component, a diamin...

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Bibliographische Detailangaben
Hauptverfasser: OGAWA KOHEI, KAMITE JUN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:This resin composition contains a polyimide and an acrylic resin, and the polyimide contains, as a tetracarboxylic acid dianhydride component, an alicyclic tetracarboxylic acid dianhydride such as 1, 2, 3, 4-cyclobutane tetracarboxylic acid dianhydride, and contains, as a diamine component, a diamine having a perfluoroalkyl group such as 2, 2 '-bis (trifluoromethyl) benzidine. The amount of the alicyclic tetracarboxylic acid dianhydride is preferably 1-80 mol% with respect to the total amount of the tetracarboxylic acid dianhydride component of the polyimide. 本发明的树脂组合物包含聚酰亚胺及丙烯酸系树脂,且聚酰亚胺含有1,2,3,4-环丁烷四羧酸二酐等脂环式四羧酸二酐作为四羧酸二酐成分,含有2,2'-双(三氟甲基)联苯胺等具有全氟烷基的二胺作为二胺成分。相对于聚酰亚胺的四羧酸二酐成分总量,脂环式四羧酸二酐的量优选为1~80摩尔%。