Polyamic acid composition and polyimide prepared therefrom

The present invention relates to a polyamic acid composition and a polyimide comprising the same, which have excellent thermal characteristics such as dimensional stability and heat resistance while having high transparency. 本发明涉及一种聚酰胺酸组合物及包括其的聚酰亚胺，其在具有高透明度的同时具有尺寸稳定性和耐热性等热特性优异的效果。...

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Bibliographische Detailangaben
Hauptverfasser:	HUANG RENHUAN, PARK SE JOO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to a polyamic acid composition and a polyimide comprising the same, which have excellent thermal characteristics such as dimensional stability and heat resistance while having high transparency. 本发明涉及一种聚酰胺酸组合物及包括其的聚酰亚胺，其在具有高透明度的同时具有尺寸稳定性和耐热性等热特性优异的效果。