Photosensitive chip and preparation method thereof, laser radar and electronic equipment

The invention relates to the technical field of semiconductor packaging, and provides a light sensing chip and a preparation method thereof, a laser radar and electronic equipment. The preparation method comprises the following steps: providing a wafer; the wafer comprises a plurality of core bodies which can be cut and separated, and each core body comprises a substrate and a light detection module arranged on the substrate; providing a light-transmitting body; the light-transmitting body is matched with the wafer; arranging a dielectric layer for shading on at least one of the wafer or the light-transmitting body; light transmission holes are formed in areas, corresponding to the light detection modules, of the dielectric layer; bonding the wafer and the light-transmitting body to form a chip board group; forming the dielectric layer between the wafer and the light-transmitting body so as to form a cavity for accommodating the light detection module through the light-transmitting hole; and cutting the chip