Electronic device
The invention provides an electronic device. The electronic device comprises a first substrate structure, a plurality of electronic elements and a second substrate structure. The first substrate structure comprises a first base material. The plurality of electronic components are disposed on the fir...
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| Hauptverfasser: | , , , , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention provides an electronic device. The electronic device comprises a first substrate structure, a plurality of electronic elements and a second substrate structure. The first substrate structure comprises a first base material. The plurality of electronic components are disposed on the first substrate. The second substrate structure is coupled to the first substrate structure. The second substrate structure comprises a second base material, a protection circuit, a driving circuit and a bonding pad. The protection circuit is disposed on the second substrate. The driving circuit is arranged on the second substrate and is used for driving at least one part of the plurality of electronic elements. The bonding pad is disposed on the second substrate. The protection circuit is respectively coupled to the bonding pad and the driving circuit. The electronic device provided by the embodiment of the invention can reduce the damage caused by electrostatic discharge or reduce the influence of the bonding proces |
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