METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

The present disclosure relates to a method of manufacturing a semiconductor device in which a bonding area is specified by superimposing a horizontal line partially constituting a cross directrix displayed on a monitor of a wire bonding apparatus on a first line segment of a first mark, and superimp...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TAKAISHI RYUSEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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