METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

The present disclosure relates to a method of manufacturing a semiconductor device in which a bonding area is specified by superimposing a horizontal line partially constituting a cross directrix displayed on a monitor of a wire bonding apparatus on a first line segment of a first mark, and superimp...

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Bibliographische Detailangaben
1. Verfasser:	TAKAISHI RYUSEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present disclosure relates to a method of manufacturing a semiconductor device in which a bonding area is specified by superimposing a horizontal line partially constituting a cross directrix displayed on a monitor of a wire bonding apparatus on a first line segment of a first mark, and superimposing a vertical line partially constituting the cross directrix on a first line segment of a second mark. 本公开涉及一种制造半导体器件的方法，其中键合区域通过以下来指定：将部分构成在导线键合设备的监测器上显示的十字准线的水平线叠加在第一标记的第一线段上，并且将部分构成十字准线的垂直线叠加在第二标记的第一线段上。