Insulation layer processing method and insulation layer processing system
The embodiment of the invention provides an insulating layer processing method and an insulating layer processing system, the method is applied to a fingerprint module, the fingerprint module comprises a substrate, an electric connection area, an acoustic layer and a polar plate, one side of the aco...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The embodiment of the invention provides an insulating layer processing method and an insulating layer processing system, the method is applied to a fingerprint module, the fingerprint module comprises a substrate, an electric connection area, an acoustic layer and a polar plate, one side of the acoustic layer is in contact with a circuit element formed on the substrate, the other side of the acoustic layer is in contact with the polar plate, and the polar plate is in contact with the substrate. The electric connection area is arranged on the substrate, and an insulating layer is arranged between an input pin included in the electric connection area and the polar plate; the method comprises the steps that a current source is connected with the input pin, and the input pin is grounded through the polar plate, so that the current source, the input pin and the polar plate form a series circuit; and controlling the current source to output breakdown voltage to break down the insulating layer. By applying the insu |
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