Off-chip system of system-on-chip and application program curing method

The invention provides an off-chip system of a system-on-chip and an application program curing method, and relates to the technical field of the system-on-chip, the off-chip system of the system-on-chip comprises the system-on-chip, a chip selection module, a driving module and an anti-radiation nonvolatile memory, the nonvolatile memory is anti-radiation, and the nonvolatile memory comprises a plurality of substrates, in other words, the nonvolatile memory is an aerospace-level nonvolatile memory, and the compatible connection between the system-level chip and the nonvolatile memory can be realized through the chip selection module and the driving module, so that the problem that the system-level chip and the aerospace-level nonvolatile memory are incompatible in the prior art is solved. 本申请提供了一种系统级芯片的片外系统和应用程序固化方法，涉及系统级芯片技术领域，系统级芯片的片外系统包括系统级芯片、片选模块、驱动模块、抗辐射的非易失性存储器，非易失性存储器抗辐射，且非易失性存储器包括多个基片，即非易失性存储器为宇航级非易失性存储器，通过片选模块和驱动模块可以实现系统级芯片和非易失性存储器的兼容性连接，从而解决了在先技术中系统级芯片和宇航级非易失性存储器不兼容的问题。