Splicing imaging method for laser segmented exposure
The invention discloses a laser segmented exposure splicing imaging method, which belongs to the field of laser direct imaging, and comprises the steps of S1, splicing area graph height data processing, S2, obtaining of a first segment of actual exposure graph and a second segment of actual exposure...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a laser segmented exposure splicing imaging method, which belongs to the field of laser direct imaging, and comprises the steps of S1, splicing area graph height data processing, S2, obtaining of a first segment of actual exposure graph and a second segment of actual exposure graph, S3, alignment exposure processing, and S4, splicing area graph height data processing. Wherein the splicing area pattern is cut according to a rectangular diagonal line, the upper section of the total exposure pattern belongs to a first section of actual exposure pattern, and the lower section of the total exposure pattern belongs to a second section of actual exposure pattern. During exposure, the first section of actual exposure pattern is firstly exposed, and then the second section of actual exposure pattern is exposed, so that secondary exposure of the splicing region is avoided, even if the splicing region adopts an overlapping region exposure mode, the height h of a pattern overlapping region in the |
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