Preparation method of high-temperature-resistant ink

The invention discloses a preparation method of high-temperature-resistant ink, and belongs to the technical field of ink. According to the tin-containing alkyl organic silicon resin prepared by the invention, the crosslinking density of ink can be improved, and the heat resistance of the ink is fur...

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Bibliographische Detailangaben
Hauptverfasser:	ZHOU YONGJIN, SHEN XIAOPING, CHEN CHAO, ZHOU HONGBING, ZHENG ZENGBIAO, ZHOU ZIHANG, MA ENCHAO, ZHANG QINGXI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The invention discloses a preparation method of high-temperature-resistant ink, and belongs to the technical field of ink. According to the tin-containing alkyl organic silicon resin prepared by the invention, the crosslinking density of ink can be improved, and the heat resistance of the ink is further enhanced; the preparation method comprises the following steps: carrying out an amino-acrylic acid addition reaction on 3-(methacryloyloxy) propyl trimethoxy silane and 2-aminodiphenyl sulfide to form a stable silicon-nitrogen bond; due to the formation of the silicon-nitrogen bond, the binding force between silane and ink molecules can be improved, so that the overall thermal stability of the ink is improved; tin alkyl amine can improve the crosslinking density of the ink and further enhance the heat resistance of the ink; the ink disclosed by the invention has excellent heat resistance, the adhesive force is grade 1, and after being fired at 500 DEG C, the ink has a good surface and is free from phenomena of