Laser sealing method for closing vent hole of micromechanical device

The vent hole of the micromechanical device is sealed by laser irradiation. A micromechanical device has a substrate, such as silicon. The substrate has an upper surface and defines: a vent opening into a chamber containing the device; and a trench extending downwardly from the upper surface and positioned offset from the vent hole. A laser pulse is applied to the substrate at or within the trench. This causes a portion of the substrate below the upper surface to melt and travel laterally to laterally enclose and seal the vent from below the upper surface. 微机械装置的通气孔利用激光照射来密封。微机械装置具有衬底，诸如硅。该衬底具有上表面，并且限定：通气孔，其通向包含装置的腔室；以及沟槽，其从上表面向下延伸并定位成从通气孔偏移。激光脉冲在沟槽处或沟槽内被施加到衬底。这引起衬底的位于上表面下方的一部分熔化并侧向地行进，以从上表面下面侧向地封闭住和密封通气孔。