Temperature control instant noodle bowl cooled by semiconductor

The invention relates to the technical field of food cooling electric appliances, in particular to a semiconductor-cooled temperature-controlled instant noodle bowl which comprises an instant noodle assembly, a temperature control module and a temperature control module. The cooling assembly is arranged between the bowl body and the protective shell and comprises a power supply connecting port formed in one side of the protective shell and a semiconductor cooling part arranged on the outer wall of the bowl body and electrically connected with the power supply connecting port. And the semiconductor cooling component comprises an insulating heat-conducting sheet arranged on the outer wall of the bowl body, and at least two groups of N-type semiconductors and P-type semiconductors which are arranged in the protective shell and are distributed at intervals. According to the instant noodle bowl, the instant noodle assembly and the cooling assembly are matched with each other, heat in the bowl body can be absorbed