Thermosetting film, composite sheet, and method for manufacturing semiconductor device

A thermosetting film having a shear strength of 100 N/2 mm or more, a first test piece comprising a cured product of the thermosetting film, a copper plate provided on the entire surface of one surface of the cured product, and a silicon chip provided on the entire surface of the other surface of the cured product; a melt viscosity V0 at a temperature of 90 DEG C of a second test piece obtained by storing the thermosetting film at 5 DEG C for 168 hours is measured, and a melt viscosity V1 at a temperature of 90 DEG C of a third test piece obtained by storing the thermosetting film at 40 DEG C for 504 hours is measured. And the melt viscosity increase rate VR of the thermosetting film calculated using V1 and V0 is 600% or less. 一种热固性膜，其具备所述热固性膜的固化物、设置在所述固化物的一个面的整个面上的铜板、及设置在所述固化物的另一个面的整个面上的硅芯片而构成的第一试验片的剪切强度为100N/2mm□以上，测定在5℃下将所述热固性膜保存168小时而得到的第二试验片的温度为90℃时的熔融粘度V0、并测定在40℃下将所述热固性膜保存504小时而得到的第三试验片的温度为90℃时的熔融粘度V1时，使用所述V1及V0而计算出的所述热固性膜的熔融粘度上升率VR为600％以下。