Pad-in-bottle (PIB) technique for copper barrier paste

A novel pad in bottle (PIB) technology for advanced chemical mechanical planarization (CMP) copper barrier CMP compositions, systems and processes has been disclosed for use with polyurethane-based polishing pads having a plurality of asperities. A CMP composition includes an abrasive, polyurethane...

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Bibliographische Detailangaben
Hauptverfasser:	LANGAN JOHN G, SCHLUETER JAMES ALLEN, SAMPUNO, YVES, SHI XIAOBO, WAQAS RAHUL, O 'NEILL MARK LEONARD, A.PHILLIPS 'AN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	A novel pad in bottle (PIB) technology for advanced chemical mechanical planarization (CMP) copper barrier CMP compositions, systems and processes has been disclosed for use with polyurethane-based polishing pads having a plurality of asperities. A CMP composition includes an abrasive, polyurethane beads, and a surfactant. The use of a PIB-type Cu barrier CMP polishing composition achieves an increase in polishing pad life. 已经公开了一种用于先进化学机械平面化(CMP)铜阻隔CMP组合物、系统和工艺的新型瓶中垫(PIB)技术，其用于与具有多个微凸体的基于聚氨酯的抛光垫一起使用。CMP组合物包含磨料、聚氨酯珠粒和表面活性剂。使用PIB型Cu阻隔CMP抛光组合物实现了抛光垫寿命增加。