Processing method of stepped golden finger circuit board and PCB

The invention discloses a processing method of a stepped golden finger circuit board and a PCB, and relates to the technical field of PCB processing, and the processing method comprises the following steps: S10, providing a daughter board provided with golden fingers; s20, pasting an adhesive tape o...

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Bibliographische Detailangaben
Hauptverfasser: CHEN XIAYUAN, LIU MENGRU, YI YAN, XU SHENG, NIE YAXIONG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a processing method of a stepped golden finger circuit board and a PCB, and relates to the technical field of PCB processing, and the processing method comprises the following steps: S10, providing a daughter board provided with golden fingers; s20, pasting an adhesive tape on the surface of the golden finger, stacking a gasket on the adhesive tape, and pressing to form a mother board; s30, processing the mother board sequentially through a board drying process and a board grinding process, and before the board grinding process, processing a groove in a position, corresponding to the golden finger, of the surface of the mother board so as to prevent the mother board from forming a bulge protruding out of the surface when the mother board enters the board grinding process; and S40, the mother board is subjected to board grinding treatment. Before the mother board grinding process, the groove is formed in the position, corresponding to the golden finger, of the surface of the mother boar