Semiconductor element, semiconductor package and manufacturing method thereof

The invention discloses a semiconductor device, a semiconductor package and a manufacturing method thereof, and the method comprises the steps: providing a wafer which comprises an active surface, a back surface, a semiconductor device region and a cutting channel region, the cutting channel region is provided with a plurality of conductive columns, and the plurality of conductive columns do not penetrate to the back surface of the wafer; a cutter is used for cutting the wafer so as to cut off part of the wafer and part of the conductive columns in the cutting channel area, and the width of the cutter is smaller than that of the cutting channel area; grinding the back surface of the wafer so as to expose the plurality of conductive columns; and separating the wafer into a plurality of semiconductor chips through the cut wafer part in the cutting channel region. The present invention provides a highly integrated semiconductor element, a semiconductor package, and a method for manufacturing the same by providin