Semiconductor bonding method based on atomic cluster flux

The invention discloses a semiconductor bonding method based on atomic cluster flux, and belongs to the technical field of integrated circuit preparation. The method comprises the following steps: generating a cluster beam through a magnetron sputtering method; the cluster beams are deposited on the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JANG MIN-HO, GU LUWEI, WANG TING, ZHANG JIANJUN, SONG FENGQI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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