Method and apparatus for dynamically controlling temperature of wet etching process
The invention discloses a method and equipment for dynamically controlling the temperature of a wet etching process, and the method comprises the steps: carrying out the multi-point temperature detection of a reaction liquid in an etching pool, obtaining the temperature distribution data, obtaining...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention discloses a method and equipment for dynamically controlling the temperature of a wet etching process, and the method comprises the steps: carrying out the multi-point temperature detection of a reaction liquid in an etching pool, obtaining the temperature distribution data, obtaining the liquid inlet rate and liquid outlet rate of the etching pool, and obtaining the rate change data of the liquid exchange rate of the etching pool; comparing the temperature distribution data with a standard temperature three-dimensional model, judging whether a temperature adjusting condition is met or not, and if not, not adjusting the temperature of the reaction liquid in the etching pool; if the condition is met, the step is executed: the temperature control module calculates the adjustment temperature according to the rate change data of the etching pool and the monitored multi-point temperature distribution data, and the heating module heats the corresponding point according to the calculated adjustment tem |
---|