High-thermal-conductivity diene electronic packaging composite material and preparation method thereof

The invention provides a high-thermal-conductivity diene electronic packaging composite material which is prepared by the following steps: uniformly stirring and mixing 80-90 parts by mass of a thermal conductive filler, 6-12 parts by mass of a diene raw material, 0.5-1 part by mass of an antioxidan...

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Bibliographische Detailangaben
Hauptverfasser:	PAN DONGYE, CHEN XUEJUN, BAI DACHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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