High-thermal-conductivity diene electronic packaging composite material and preparation method thereof

The invention provides a high-thermal-conductivity diene electronic packaging composite material which is prepared by the following steps: uniformly stirring and mixing 80-90 parts by mass of a thermal conductive filler, 6-12 parts by mass of a diene raw material, 0.5-1 part by mass of an antioxidant, 1-3 parts by mass of a flexibilizer, 0.5-1 part by mass of a coupling agent, 0.5-1 part by mass of a defoaming agent, 0.5-1 part by mass of a flatting agent and 0.5-1 part by mass of pigment under a vacuum condition at 80 DEG C to obtain a resin base material; after a resin base material and a catalyst solution are mixed, the mass ratio of the resin base material to the catalyst solution is 10000: (0.2-2), and then a multi-stage curing process is adopted to obtain the high-thermal-conductivity diene electronic packaging composite material. The components can be uniformly mixed, the dispersity is better, and the processing is convenient; and meanwhile, the high filling of the filler can reduce the volume shrinkag