Light-cured acrylic resin pressure-sensitive adhesive and preparation method thereof

The invention provides a light-cured acrylic resin pressure-sensitive adhesive. The light-cured acrylic resin pressure-sensitive adhesive is prepared from the following raw materials in parts by weight: 60 to 90 parts of an acrylate copolymer monomer, 0.1 to 3 parts of a thermal initiator, 0.05 to 5...

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Bibliographische Detailangaben
Hauptverfasser: YAN BINGHUA, CHEN JUNMING, HUANG YUAN, YAN KOU, ZHANG LIANGBAO
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention provides a light-cured acrylic resin pressure-sensitive adhesive. The light-cured acrylic resin pressure-sensitive adhesive is prepared from the following raw materials in parts by weight: 60 to 90 parts of an acrylate copolymer monomer, 0.1 to 3 parts of a thermal initiator, 0.05 to 5 parts of a photoinitiator, 0.1 to 0.5 part of a chain transfer agent, 0.01 to 0.5 part of a cross-linking agent, 20 to 40 parts of a reactive diluent and 0.01 to 0.4 part of inorganic nanoparticles. According to the invention, an acrylic ester copolymer monomer is prepared into an acrylic acid homopolymer or copolymer by adopting a segmented polymerization mode of firstly carrying out thermal initiation polymerization and then carrying out bulk polymerization according to the components. The segmented polymerization mode can release and transfer the generated heat, so that the polymerization uniformity of the adhesive is ensured, the uniformity of molecular weight is further ensured, and the problems of adhesive b