Cutting mechanism and cutting system
The invention discloses a cutting mechanism and a cutting system. The cutting mechanism comprises a cutter, a focusing assembly and a laser assembly. The laser assembly is arranged on the side, away from the tool, of the focusing assembly. The cutter comprises a cutting edge used for cutting a machi...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a cutting mechanism and a cutting system. The cutting mechanism comprises a cutter, a focusing assembly and a laser assembly. The laser assembly is arranged on the side, away from the tool, of the focusing assembly. The cutter comprises a cutting edge used for cutting a machined part, and the cutter is made of a light-transmitting material. The focusing assembly comprises a zooming curved surface facing the laser assembly. The laser assembly is configured to be capable of emitting laser, and the laser can penetrate into the cutter from the zoom curved surface. The zoom curved surface is configured to focus the transmitted laser, so that the focus of the laser can be located at the cutting point of the cutting edge. The laser penetrating through the cutter is focused on the to-be-machined part of the machined part, so that the material property of the to-be-machined part of the machined part is changed, the cutting force is reduced, the material removal rate is increased, machining dama |
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