SMT device for FPC bonding pad surface mounting
The invention relates to the technical field of SMT (Surface Mount Technology) devices, and discloses an SMT device for FPC (Flexible Printed Circuit) bonding pad surface mounting, which comprises a device shell, a guide assembly, a grid carrying mechanism, a feeding mechanism and an adjusting mecha...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | XU ZHIHUA LIAO TIANHUA HUANG YUEMING ZHAO HONGBO CHEN ZHIPING |
| description | The invention relates to the technical field of SMT (Surface Mount Technology) devices, and discloses an SMT device for FPC (Flexible Printed Circuit) bonding pad surface mounting, which comprises a device shell, a guide assembly, a grid carrying mechanism, a feeding mechanism and an adjusting mechanism are sequentially arranged in the device shell from top to bottom, the guide assembly guides a scraper assembly, and the adjusting mechanism synchronously guides along with the scraper assembly; the scraper assembly is guided and conveyed through the guiding and conveying assembly to scrape and brush a steel mesh on the mesh carrying mechanism, and the adjusting mechanism is synchronously guided and conveyed along with the scraper assembly, so that the adjusting mechanism can continuously correspond to the position of the scraper assembly, and the adjusting mechanism can conveniently adjust the printing thickness of soldering paste in real time in the soldering paste printing process.
本发明涉及SMT装置的技术领域，公开了一种FPC焊盘 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117896910A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117896910A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117896910A3</originalsourceid><addsrcrecordid>eNrjZNAP9g1RSEkty0xOVUjLL1JwC3BWSMrPS8nMS1coSExRKC4tSksEyuXml-aVAAV5GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcQFQbV5qSbyzn6GhuYWlmaWhgaMxMWoArtsp_g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SMT device for FPC bonding pad surface mounting</title><source>esp@cenet</source><creator>XU ZHIHUA ; LIAO TIANHUA ; HUANG YUEMING ; ZHAO HONGBO ; CHEN ZHIPING</creator><creatorcontrib>XU ZHIHUA ; LIAO TIANHUA ; HUANG YUEMING ; ZHAO HONGBO ; CHEN ZHIPING</creatorcontrib><description>The invention relates to the technical field of SMT (Surface Mount Technology) devices, and discloses an SMT device for FPC (Flexible Printed Circuit) bonding pad surface mounting, which comprises a device shell, a guide assembly, a grid carrying mechanism, a feeding mechanism and an adjusting mechanism are sequentially arranged in the device shell from top to bottom, the guide assembly guides a scraper assembly, and the adjusting mechanism synchronously guides along with the scraper assembly; the scraper assembly is guided and conveyed through the guiding and conveying assembly to scrape and brush a steel mesh on the mesh carrying mechanism, and the adjusting mechanism is synchronously guided and conveyed along with the scraper assembly, so that the adjusting mechanism can continuously correspond to the position of the scraper assembly, and the adjusting mechanism can conveniently adjust the printing thickness of soldering paste in real time in the soldering paste printing process.
本发明涉及SMT装置的技术领域，公开了一种FPC焊盘</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240416&DB=EPODOC&CC=CN&NR=117896910A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240416&DB=EPODOC&CC=CN&NR=117896910A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>XU ZHIHUA</creatorcontrib><creatorcontrib>LIAO TIANHUA</creatorcontrib><creatorcontrib>HUANG YUEMING</creatorcontrib><creatorcontrib>ZHAO HONGBO</creatorcontrib><creatorcontrib>CHEN ZHIPING</creatorcontrib><title>SMT device for FPC bonding pad surface mounting</title><description>The invention relates to the technical field of SMT (Surface Mount Technology) devices, and discloses an SMT device for FPC (Flexible Printed Circuit) bonding pad surface mounting, which comprises a device shell, a guide assembly, a grid carrying mechanism, a feeding mechanism and an adjusting mechanism are sequentially arranged in the device shell from top to bottom, the guide assembly guides a scraper assembly, and the adjusting mechanism synchronously guides along with the scraper assembly; the scraper assembly is guided and conveyed through the guiding and conveying assembly to scrape and brush a steel mesh on the mesh carrying mechanism, and the adjusting mechanism is synchronously guided and conveyed along with the scraper assembly, so that the adjusting mechanism can continuously correspond to the position of the scraper assembly, and the adjusting mechanism can conveniently adjust the printing thickness of soldering paste in real time in the soldering paste printing process.
本发明涉及SMT装置的技术领域，公开了一种FPC焊盘</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAP9g1RSEkty0xOVUjLL1JwC3BWSMrPS8nMS1coSExRKC4tSksEyuXml-aVAAV5GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcQFQbV5qSbyzn6GhuYWlmaWhgaMxMWoArtsp_g</recordid><startdate>20240416</startdate><enddate>20240416</enddate><creator>XU ZHIHUA</creator><creator>LIAO TIANHUA</creator><creator>HUANG YUEMING</creator><creator>ZHAO HONGBO</creator><creator>CHEN ZHIPING</creator><scope>EVB</scope></search><sort><creationdate>20240416</creationdate><title>SMT device for FPC bonding pad surface mounting</title><author>XU ZHIHUA ; LIAO TIANHUA ; HUANG YUEMING ; ZHAO HONGBO ; CHEN ZHIPING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117896910A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>XU ZHIHUA</creatorcontrib><creatorcontrib>LIAO TIANHUA</creatorcontrib><creatorcontrib>HUANG YUEMING</creatorcontrib><creatorcontrib>ZHAO HONGBO</creatorcontrib><creatorcontrib>CHEN ZHIPING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>XU ZHIHUA</au><au>LIAO TIANHUA</au><au>HUANG YUEMING</au><au>ZHAO HONGBO</au><au>CHEN ZHIPING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SMT device for FPC bonding pad surface mounting</title><date>2024-04-16</date><risdate>2024</risdate><abstract>The invention relates to the technical field of SMT (Surface Mount Technology) devices, and discloses an SMT device for FPC (Flexible Printed Circuit) bonding pad surface mounting, which comprises a device shell, a guide assembly, a grid carrying mechanism, a feeding mechanism and an adjusting mechanism are sequentially arranged in the device shell from top to bottom, the guide assembly guides a scraper assembly, and the adjusting mechanism synchronously guides along with the scraper assembly; the scraper assembly is guided and conveyed through the guiding and conveying assembly to scrape and brush a steel mesh on the mesh carrying mechanism, and the adjusting mechanism is synchronously guided and conveyed along with the scraper assembly, so that the adjusting mechanism can continuously correspond to the position of the scraper assembly, and the adjusting mechanism can conveniently adjust the printing thickness of soldering paste in real time in the soldering paste printing process.
本发明涉及SMT装置的技术领域，公开了一种FPC焊盘</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN117896910A |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | SMT device for FPC bonding pad surface mounting |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T10%3A31%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=XU%20ZHIHUA&rft.date=2024-04-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN117896910A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |