SMT device for FPC bonding pad surface mounting

The invention relates to the technical field of SMT (Surface Mount Technology) devices, and discloses an SMT device for FPC (Flexible Printed Circuit) bonding pad surface mounting, which comprises a device shell, a guide assembly, a grid carrying mechanism, a feeding mechanism and an adjusting mechanism are sequentially arranged in the device shell from top to bottom, the guide assembly guides a scraper assembly, and the adjusting mechanism synchronously guides along with the scraper assembly; the scraper assembly is guided and conveyed through the guiding and conveying assembly to scrape and brush a steel mesh on the mesh carrying mechanism, and the adjusting mechanism is synchronously guided and conveyed along with the scraper assembly, so that the adjusting mechanism can continuously correspond to the position of the scraper assembly, and the adjusting mechanism can conveniently adjust the printing thickness of soldering paste in real time in the soldering paste printing process. 本发明涉及SMT装置的技术领域，公开了一种FPC焊盘