Semiconductor device

A semiconductor device having a structure in which a plurality of chips are stacked includes: a chip region; a scribe line located at the periphery of the chip region; the box dam structure separates the chip area from the scribing line; a detection wiring extending from the chip region to the scribe line by passing through the dam structure; and a detection circuit in the chip area electrically connected to the detection wiring and configured to detect a defect in the scribe line. 一种具有多个芯片堆叠的结构的半导体装置包括：芯片区；划线，其位于芯片区的周边；围坝结构，其将芯片区和划线分隔；检测布线，其通过穿过围坝结构从芯片区延伸到划线；以及芯片区中的检测电路，其电连接至检测布线并且被配置为检测划线中的缺陷。