Copper deposition device and method for printed circuit board production

The invention relates to the field of circuit board copper deposition equipment, and discloses a copper deposition device for printed circuit board production, the copper deposition device comprises a copper deposition groove and a conveying assembly, the conveying assembly comprises an out-groove roller group and an in-groove roller group which are located on the same horizontal plane, and the out-groove roller group and the in-groove roller group are sequentially arranged along the conveying direction of a circuit board; the out-tank roller group is arranged outside the copper deposition tank, the in-tank roller group is arranged inside the copper deposition tank, the bottom of the copper deposition tank is provided with an anode plate electrically connected with the positive electrode of the power supply, the out-tank roller group is provided with a cathode assembly electrically connected with the negative electrode of the power supply, and the cathode assembly is in surface contact with the surface of the