RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND COMPOUND

The present invention provides a resin composition, a cured product obtained by curing the resin composition, a laminate comprising the cured product, a method for producing the cured product, a method for producing the laminate, and a method for producing the laminate. A method for manufacturing a...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	NOZAKI ATSUYASU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTROGRAPHY HETEROCYCLIC COMPOUNDS HOLOGRAPHY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention provides a resin composition, a cured product obtained by curing the resin composition, a laminate comprising the cured product, a method for producing the cured product, a method for producing the laminate, and a method for producing the laminate. A method for manufacturing a semiconductor device including the method for manufacturing the laminate, a semiconductor device including the cured product or the laminate, and a novel compound, the resin composition including at least one resin selected from the group consisting of cyclized resins and precursors thereof; and a compound (B) that is a compound having a ring-opening polymerizable group, at least one structure selected from the group consisting of a urea bond, a urethane bond, and an amide bond not included in the cyclic structure, and a radically polymerizable group. 本发明提供一种树脂组合物、固化上述树脂组合物而成的固化物、包含上述固化物的层叠体、上述固化物的制造方法、上述层叠体的制造方法、包括上述层叠体的制造方法的半导体器件的制造方法及包含上述固化物或上述层叠体的半导体器件、以及新型化合物，所述树脂组合物包含选自环化树脂及其前体中的至少1种树脂；以及具有能够开环聚合的基团、选自脲键、氨基甲酸